| PART |
Description |
Maker |
| SD-70287-003 |
2.54mm (.100") Pitch C-Grid庐 Header
2.54mm (.100) Pitch C-Grid? Header
|
Molex Electronics Ltd.
|
| SD-70287-004 0702871009 |
2.54mm (.100") Pitch C-Grid庐 Header
2.54mm (.100) Pitch C-Grid? Header
|
Molex Electronics Ltd.
|
| 71764-0122 SD-71764-001 |
2.54mm (.100) Pitch C-Grid? Breakaway Header
2.54mm (.100") Pitch C-Grid庐 Breakaway Header
|
Molex Electronics Ltd.
|
| SDA-70545-0009 70545-0009 0705450009 |
2.54mm (.100") Pitch SL垄芒 Header
2.54mm (.100) Pitch SL Header
|
Molex Electronics Ltd.
|
| 0022282023 22-28-2023 |
2.54mm (.100) Pitch KK? Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 2 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch KK庐 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 2 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating
2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Right Angle, with Plastic Polarizing Peg, 2 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 87911-5411 0879115411 |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 54 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 54 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 54 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 70280-0068 A-70280-0068 0010897562 010-89-7562 |
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating
2.54mm (.100") Pitch C-Grid垄莽 Breakaway Header, Dual Row, Vertical, High Temperature, 56 Circuits, 0.38楼矛m (15楼矛") Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0022284108 |
2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch KK垄莽 Header, Breakaway, Vertical, 10 Circuits, 0.76楼矛m (30楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 0702800458 70280-0458 |
2.54mm (.100") Pitch C-Grid庐 Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38渭m (15渭") Gold (Au) Selective Plating, Tin (Sn) PC Tail
2.54mm (.100) Pitch C-Grid? Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail
|
Molex Electronics Ltd.
|
| 0022122264 22-12-2264 |
2.54mm (.100) Pitch KK庐 Solid Header, Right Angle, with Friction Lock, 26 Circuits, 0.51渭m (20渭) Gold (Au) Plating
2.54mm (.100) Pitch KK? Solid Header, Right Angle, with Friction Lock, 26 Circuits, 0.51μm (20μ) Gold (Au) Plating
|
Molex Electronics Ltd.
|
| A-7478-28A501 |
2.54mm (.100) Pitch KK? Solid Header, Right Angle, with Friction Lock, 28 Circuits, 0.51μm (20μ) Gold (Au) Plating
2.54mm (.100) Pitch KK垄莽 Solid Header, Right Angle, with Friction Lock, 28 Circuits, 0.51楼矛m (20楼矛) Gold (Au) Plating
|
Molex Electronics Ltd.
|
|
